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CPU INTEL Core i3-6100 BOX (3.7GHz, LGA1151, VGA)

CPU INTEL Core i3-6100 BOX (3.7GHz, LGA1151, VGA)
3644 Kč
3012 Kč bez DPH
Dostupnost: Skladem-dodání 2-4 dny
Part no.: BX80662I36100
Kód produktu: 34163181
Výrobce: INTEL
Váha: 0,138
Záruka: 36 měsíců
Kalkulačka splátek CETELEM
Kup teď 364,- Později 10 splátek
Popis produktu: table.spec_table { border: 0; font-family: verdana, helvetica, arial, sans-serif; font-size: 12px; } table.spec_table td { padding: 3px 5px; line-height: 135%; } table.spec_table td.spec_hd { font-weight: bold; padding: 20px 5px 10px 5px; } table.spec_table td.spec_hd span { min-width: 33%; background-color: #FFFFFF; padding: 3px 3px !important; border: 0; border-bottom: 1px solid #000000; } table.sh_table { font-family: verdana, helvetica, arial, sans-serif; font-size: 12px; } table.sh_table td { padding: 2px; border-left: solid 1px #E0E0E0; } table.sh_table td:first-child { border-left: 0; } table.center_td td { text-align: center } .sh_subhead { background-color: #E0E0E0 } tr.sh_subhead td { border-left: 1px solid #C0C0C0; }


General information
Type CPU / Microprocessor
Market segment Desktop
Family Intel Core i3
Model number nbsp;?nbsp; i3-6100
CPU part numbers
CM8066201927202 is an OEM/tray microprocessor
BX80662I36100 is a boxed processor (English version)
BXC80662I36100 is a boxed processor (Chinese version)

Frequency nbsp;?nbsp; 3700 MHz
Bus speed nbsp;?nbsp; 8 GT/s DMI
Clock multiplier nbsp;?nbsp; 37
Package 1151-land Flip-Chip Land Grid Array
Socket Socket 1151 / H4 / LGA1151
Size 1.48" x 1.48" / 3.75cm x 3.75cm
Introduction date September 1, 2015 (announcement) September 1, 2015 (availability in Asia) September 27, 2015 (availability elsewhere)
Price at introduction $117 (OEM)
$117 (box)
S-spec numbers

nbsp;
ES/QS processors
Production processors

Part number
QJZG
SR2HG

BX80662I36100 nbsp; +
CM8066201927202 + +
Architecture / Microarchitecture
Microarchitecture Skylake
Processor core nbsp;?nbsp; Skylake-S
Manufacturing process 0.014 micron
Data width 64 bit
The number of cores 2
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size nbsp;?nbsp; 2 x 32 KB instruction caches
2 x 32 KB data caches
Level 2 cache size nbsp;?nbsp; 2 x 256 KB caches
Level 3 cache size 3 MB shared cache
Physical memory 64 GB
Multiprocessing Uniprocessor
Features MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 nbsp;?nbsp;
AES / Advanced Encryption Standard instructions
AVX / Advanced Vector Extensions
AVX2 / Advanced Vector Extensions 2.0
BMI / BMI1 + BMI2 / Bit Manipulation instructions
F16C / 16-bit Floating-Point conversion instructions
FMA3 / 3-operand Fused Multiply-Add instructions
EM64T / Extended Memory 64 technology / Intel 64 nbsp;?nbsp;
NX / XD / Execute disable bit nbsp;?nbsp;
HT / Hyper-Threading technology nbsp;?nbsp;
VT-x / Virtualization technology nbsp;?nbsp;
VT-d / Virtualization for directed I/O

Low power features Enhanced SpeedStep technology nbsp;?nbsp;
Integrated peripherals / components
Integrated graphics GPU Type: HD 530
Microarchitecture: Gen 9 LP
Base frequency (MHz): 350
Maximum frequency (MHz): 1050
The number of supported displays: 3
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, DDR4-1866, DDR4-2133
Maximum memory bandwidth (GB/s): 34.1
Other peripherals Direct Media Interface 3.0
PCI Express 3.0 interface (16 lanes)

Electrical / Thermal parameters
Maximum operating temperature nbsp;?nbsp; 100°C
Thermal Design Power nbsp;?nbsp; 47 Watt
Notes on Intel Core i3-6100
The processor has the following security, data protection and/or software features: Secure Key and OS Guard. The CPU is compatible with DirectX 12 and OpenGL 4.4 APIs. The graphics unit has the following software features enabled: Intel Wireless Display, Quick Sync Video, Clear Video technology, Clear Video HD technology, InTru 3D technology and Insider.


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